PACK EXPO Event Details
-
Dates: October 18 – 21, 2026
-
Location: McCormick Place | Chicago, Illinois, USA
-
Array Technologies Booth: W-39050 (West Hall)
Join Array Technologies at PACK EXPO International in Chicago to see how we are bridging the gap between physical production and real-time digital visibility.
We will be running live demonstrations of our RealStamp™ Smart Packaging technology right from the show floor. RealStamp prints and verifies critical production data directly onto every package in real time. By integrating this capability directly into your line, you can minimize inventory requirements, eliminate costly labeling errors, reduce material waste, and achieve rock-solid traceability.
Stop by the booth to see RealStamp in action and discuss how to make practical smart packaging work for your operational workflow.